Deskripsi
Specifications
Essentials |
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Processor Number | G3250 | |
Status | Launched | |
Launch Date | Q3’14 | |
Lithography | 22 nm | |
Recommended Customer Price | $50.00 – $64.00 |
Performance |
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# of Cores | 2 | |
# of Threads | 2 | |
Processor Base Frequency | 3.20 GHz | |
Cache | 3 MB SmartCache | |
Bus Speed | 5 GT/s DMI2 | |
TDP | 53 W |
Memory Specifications |
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Max Memory Size (dependent on memory type) | 32 GB | |
Memory Types | DDR3-1333, DDR3L-1333 @ 1.5V | |
Max # of Memory Channels | 2 | |
Max Memory Bandwidth | 21.3 GB/s | |
ECC Memory Supported ‡ | Yes |
Graphics Specifications |
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Processor Graphics ‡ | Intel® HD Graphics | |
Graphics Base Frequency | 350.00 MHz | |
Graphics Max Dynamic Frequency | 1.10 GHz | |
Graphics Video Max Memory | 1.7 GB | |
Graphics Output | eDP/DP/HDMI/DVI/VGA | |
Max Resolution (HDMI 1.4)‡ | 1920×1080@60Hz | |
Max Resolution (DP)‡ | 2560×1600@60Hz | |
Max Resolution (eDP – Integrated Flat Panel)‡ | 2560×1600@60Hz | |
Max Resolution (VGA)‡ | 1920×1200@60Hz | |
DirectX* Support | 11.1/12 | |
OpenGL* Support | 4.3 | |
Intel® Quick Sync Video | Yes | |
# of Displays Supported ‡ | 3 |
Expansion Options |
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Scalability | 1S Only | |
PCI Express Revision | Up to 3.0 | |
PCI Express Configurations ‡ | Up to 1×16, 2×8, 1×8+2×4 | |
Max # of PCI Express Lanes | 16 |
Package Specifications |
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Sockets Supported | FCLGA1150 | |
Max CPU Configuration | 1 | |
Thermal Solution Specification | PCG 2013C | |
TCASE | 72°C | |
Package Size | 37.5mm x 37.5mm | |
Low Halogen Options Available | See MDDS |
Advanced Technologies |
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Intel® Turbo Boost Technology ‡ | No | |
Intel® vPro Technology ‡ | No | |
Intel® Hyper-Threading Technology ‡ | No | |
Intel® Virtualization Technology (VT-x) ‡ | Yes | |
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | No | |
Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes | |
Intel® TSX-NI | No | |
Intel® 64 ‡ | Yes | |
Instruction Set | 64-bit | |
Instruction Set Extensions | SSE4.1/4.2 | |
Idle States | Yes | |
Enhanced Intel SpeedStep® Technology | Yes | |
Thermal Monitoring Technologies | Yes | |
Intel® Stable Image Platform Program (SIPP) | No |
Intel® Data Protection Technology |
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Intel® AES New Instructions | No | |
Secure Key | Yes |
Intel® Platform Protection Technology |
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Trusted Execution Technology ‡ | No | |
Execute Disable Bit ‡ | Yes |
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